JPH01158670U - - Google Patents
Info
- Publication number
- JPH01158670U JPH01158670U JP5322188U JP5322188U JPH01158670U JP H01158670 U JPH01158670 U JP H01158670U JP 5322188 U JP5322188 U JP 5322188U JP 5322188 U JP5322188 U JP 5322188U JP H01158670 U JPH01158670 U JP H01158670U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- surface mount
- terminal board
- molded
- located inside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5322188U JPH01158670U (en]) | 1988-04-20 | 1988-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5322188U JPH01158670U (en]) | 1988-04-20 | 1988-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01158670U true JPH01158670U (en]) | 1989-11-01 |
Family
ID=31279211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5322188U Pending JPH01158670U (en]) | 1988-04-20 | 1988-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01158670U (en]) |
-
1988
- 1988-04-20 JP JP5322188U patent/JPH01158670U/ja active Pending